BURNDY
Airmax VS
High Speed Backpanel Connectors

Scaleability

The basic building block of an airmax connector is an IMLA (Insert Molded Leadframe Assembly) and module scan consist of a number of these IMLA's. AirMax VSŪ connectors are scaleable to the number of columns (or IMLA's). By developing housings dedicated to certain IMLA-counts, various module sizes can be offered. Even IMLA counts per module are recommended in order to enjoy the very low cross talk performance, even when multiple modules are stacked. FCI has IMLA’s available in 15 position, 12 position and 9 position.

Flexibility

The IMLA design offers maximum flexibility by its "open pin field" structure. Each of the pins in an IMLA can be assigned as per what the application dictates. In some applications, both single ended & differential pair signals are combined with power within the same AirMax VSŪ module. A 15 position IMLA accommodates 5 differential pairs, where as a 12 position IMLA supports 4 differential pairs and a 9 position IMLA 3 differential pairs.

High Density

When compared to other high speed connector offerings, AirMax VSŪ connectors offer the highest pin density, at a given plug in unit pitch in a system. For example, within a 25mm card pitch, a 5 pair 2 mm AirMax VSŪ module provides 75 pins (or 25 differential pairs) per linear centimeter. If routing density is more important than pin density, modules with IMLA's on a 3 mm spacing are available to help reducing the layer count of a PCB by providing the possibility to route multiple traces onto a single layer.

Low Cost

In some applications, opening the IMLA spacing up from 2 mm to 3mm by using a dedicated housing, resulted in a significant layer count reduction of the PCB because multiple differential pairs can be routed onto the same layer. The fact that AirMax VSŪ does not contain shields (VS = Virtual Shield) generally speaking results in less (ground) vias in a back plane, which offers another opportunity for cost reduction.

Features

• A full set of building blocks for backplane, co-planar, mezzanine, and cable-to-board applications in Hard Metric building practices
• Innovative edge-coupling technology and air dielectric between adjacent conductors deliver lowest insertion loss and crosstalk
• High-speed serial data rates can scale from 2.5 Gb/s to beyond 12 Gb/s without requiring redesign of a basic platform
• Opposed dual-beam receptacle contact structure provides high reliability
• Contains no interleaving shields reducing connector weight, cost, and PCB routing complexity
• Allows for allocation of differential or single-ended signals or power within the same signal module connector
• Co-planar modules are available with 15 contacts (5 differential pairs), 12 contacts (4 pairs), or 9 contacts (3 pairs) per column
• 2 mm pitch, 5-pair configuration provides 63 differential pairs per linear inch on 25 mm (1.0 inch) card slot spacing
• Wider 3m column spacing offers the opportunity to reduce board cost by routing more traces on a single board layer
• Compact 12 mm-wide power modules provide increased current-carrying capacity of 80 Amps with 150 V voltage rating
• "Eye of the Needle" (EON)-compliant tail for press-fit PCB termination
• Available guidance modules provide alignment capability prior to connector engagement
• Lead-free and RoHS-compatible options are available